As AI clusters expand across tens of thousands of GPUs, electrical copper cables are hitting thermal and signal integrity walls. Silicon photonics is moving optical transceivers directly onto the processor substrate.
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As AI clusters expand across tens of thousands of GPUs, electrical copper cables are hitting thermal and signal integrity walls. Silicon photonics is moving optical transceivers directly onto the processor substrate.
In modern AI gigawatt datacenters, the primary limitation on training speed is no longer compute—it is interconnect bandwidth. Traditional copper cables dissipate immense heat and struggle to transmit multi-terabit signals across racks. Enter Co-Packaged Optics (CPO).
Light Replacing Electricity at the Substrate Level
By integrating micro-lasers and optical wave-guides directly onto the multi-chip module alongside the GPU die, CPO reduces data transmission energy consumption by 70% while scaling bisectional bandwidth into petabits per second.
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