The End of Copper Interconnects: How Co-Packaged Optics Is Solving the AI Bandwidth Bottleneck

In modern AI gigawatt datacenters, the primary limitation on training speed is no longer compute—it is interconnect bandwidth. Traditional copper cables dissipate immense heat and struggle to transmit multi-terabit signals across racks. Enter Co-Packaged Optics (CPO).

Light Replacing Electricity at the Substrate Level

By integrating micro-lasers and optical wave-guides directly onto the multi-chip module alongside the GPU die, CPO reduces data transmission energy consumption by 70% while scaling bisectional bandwidth into petabits per second.